AMD Open 3.0 Brings Simplicity, Power Efficiency and Cost-Effectiveness to the Data Center
– Unveils First-ever Open, Modular Platform for the Masses <b>-</b>
SANTA CLARA, Calif. -1/16/2013 OPEN COMPUTE SUMMIT – AMD
(NYSE: AMD) today is launching the AMD Open 3.0 platform (formerly
codenamed ”Roadrunner,”) a radical rethinking of the server motherboard
designed to the standards developed by the Open Compute Project. AMD
Open 3.0 enables substantial gains in computing flexibility, efficiency
and operating cost by simplifying motherboard design with a single base
product to address multiple enterprise workloads, including
high-performance computing, cloud infrastructure and storage. This
innovative design is optimized to eliminate features typically
over-provisioned in traditional server offerings.
Today’s servers are designed with a ”one size fits most” approach
incorporating many features and capabilities that can inefficiently
utilize space and power, increasing cost. Many mega data centers have
engineers developing optimized platforms with the minimum set of
components for specific workloads. The desired result is a tailored
solution with the ideal combination of power, space and cost. The AMD
Open 3.0 platform is designed to easily enable IT professionals to
”right size” the server to meet specific compute requirements. Fidelity
Investments and Goldman Sachs are evaluating AMD Open 3.0 as part of
their collaboration on the Open Compute Project.
”We became involved with the Open Compute Project very early as we
saw a pervasive demand for simplified, energy efficient servers,” said
Suresh Gopalakrishnan, corporate vice president and general manager,
Server, AMD. ”Our goal is to reduce data center power consumption and
cost yet increase performance and flexibility- we believe that AMD Open
3.0 achieves this.”
”This is a realization of the Open Compute Project’s mission of
‘hacking conventional computing infrastructure,’” said Frank Frankovsky,
chairman of the Open Compute Foundation and VP of Hardware Design and
Supply Chain at Facebook. ”What’s really exciting for me here is the way
the Open Compute Project inspired AMD and specific consumers to
collaboratively bring our ‘vanity-free’ design philosophy to a
motherboard that suited their exact needs.”
AMD Open 3.0, powered by the recently announced AMD OpteronT 6300
Series processors, can be installed in all standard 19″ rack
environments without modification, as well as in Open Rack environments.
The AMD Open 3.0 motherboard is a 16″ x 16.7″ board designed to fit
into 1U, 1.5U, 2U or 3U rack height servers. It features two AMD Opteron
6300 Series processors, each with 12 memory sockets (four channels with
three DIMMs each,) 6 Serial ATA (SATA) connections per board, one dual
channel gigabit Ethernet NIC with integrated management, up to four PCI
Express® expansion slots, a mezzanine connector for custom module
solutions, one serial port and two USB ports. Specific PCI Express card
support is dependent on usage case and chassis height.
Pre-production AMD Open 3.0 systems are currently available to select
customers. Production systems from Quanta Computer and Tyan are
expected to be available through Avnet Electronics Marketing, Penguin
Computing and other system integrators before the end of Q1.
”We have eagerly awaited the AMD Open 3.0 platform as it brings the
benefits and spirit of the Open Compute Project to a much wider set of
customers,” said Charles Wuischpard, CEO, Penguin Computing. ”As we
deliver a new line of Penguin servers based on AMD Open 3.0 and AMD
Opteron 6300 Series processors, our high performance computing, cloud
and enterprise customers can now deploy application-specific systems
using the same core building blocks that are cost, performance and
energy optimized and perhaps most important, consistent. We think this
initiative eliminates unnecessary complexity and provides new levels of
supportability and reliability to the modern data center.”
Gopalakrishnan will discuss AMD’s latest Open Compute development and
its impact on the industry at the Open Compute Summit today in a
session titled ”An Introduction to the Open Compute 3.0 Modular Server”
at 3:30 p.m. PT. Static demonstrations of the AMD Open 3.0 will also be
shown in AMD’s booth B4.
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